Our superior cooling technology to keep your temperatures low at a high framerate
*NEW for RX 6x50 Series* High TG Copper PCB
The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.
*NEW for RX 6x50 Series* Optimized Composite Heatpipe
The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module.
*NEW for RX 6x50 Series* Metal Backplate with Thermal Pad
The high quality aluminum backplate is not just for styling. It also protects the components on the backside of the PCB and helps dissipate the heat from the PCB with a high performance thermal pad in between.
*NEW for RX 6x50 Series* Frontplate Heatsink
Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.
*NEW for RX 6x50 Series* Angular Velocity Fan Blade
The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.
*NEW for RX 6000 Series* Hybrid Fan Blade
The new hybrid fan design combines the quietness of a traditional axial fan design and strong air pressure of a blower fan design to generate an improvement in the downward air pressure through the fan while keeping the fan noise low.
*NEW for RX 6000 Series* WAVE Fin design
The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise.
*NEW for RX 6000 Series* V-Shape Fin Design for GPU cooling
The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.
*NEW for RX 6000 Series* Integrated Cooling Module
The combined Memory & VRM cooling module cools the memory, MOSFET, and the chokes. Two heat pipes are added underneath the module to dissipate the heat from the components with better efficiency.
*NEW for RX 6000 Series* K6.5 Memory Pad
When compared to the previous K5, the K6.5 Memory Pad has a nearly 38% better thermal conductivity between the components and the cooler.
Intelligent Fan Control
Fan speed is intelligently controlled to keep the GPU, memory, PWM IC and other components as low as possible in temperature to balance performance, and fan noise.
Precision Fan Control
Standard industry fans may have up to 10% difference between fan rotation cycles (RPM). The Fan IC Control on SAPPHIRE graphics cards reduce differential at approximately 3%. This up to 70% improvement on accuracy ensures that cooling and noise performance of every graphics card is up to scratch.
Robust VRM Cooling
The SAPPHIRE graphics cards are designed with robust VRM cooling and have a high thermal conductivity pad on the back-plate to take away the heat efficiently and effectively.
Robust Memory Cooling
One of the hottest parts on a next-gen graphics card is generated from memory. A robust memory cooling solution has been integrated into each SAPPHIRE graphics card to cool down memory with a specially designed independent cooling module.
Tri-X Cooling Technology
The Tri-X Cooling Solution is powered by three large fans to optimize wind flow efficiency. The tunneled fins on the fans aid in increasing the convection of airflow to ensure that Tri-X cooling is a low temperature and low noise cooling solution.
Dual-X Cooling Technology
SAPPHIRE's acclaimed Dual-X Cooling is powered by two massive yet silent fans and state-of-the-art radiator design. The streamlined form of our 95mm blades mean greater airflow and superior heatsink coverage at lower noise compared to standard cooling designs.