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EDGE+ APEX X100 COM-HPC SOM

  • AMD FP11 Embedded X100 Series Glacier Peak Processor (up to 85W TDP)
  • COM-HPC Client B Form Factor (120mm x 120mm)
  • 64GB and 128GB LPDDR5X Options
  • Infineon AurixTC387Q Power management and Safety monitor
     *FuSa Capable Power Design
  • Trusted Platform Module 2.0 compliant
  • AMI Aptio UEFI/BIOS
  • Worldwide EMI and Safety Compliance Certifications

Where To Buy   Contact Us

Introducing
SAPPHIRE EDGE+ APEX X100 COM-HPC SOM

The SAPPHIRE EDGE+ APEX X100 COM-HPC SOM features the AMD Ryzen™ AI Embedded X100 Series device on an industry-standard COM-HPC form-factor board.
It combines CPU, GPU, and NPU acceleration to support real-time perception, complex scene understanding, and autonomous decision-making. Designed for continuous industrial operation, it also delivers deterministic real-time performance, a unified memory architecture, and long-term lifecycle support for demanding edge AI deployments.

 

Industry-Standard COM-HPC Client Size B Form Factor

The SAPPHIRE EDGE+ APEX X100 COM-HPC SOM features an industry-standard COM-HPC Client Size B form factor (120 mm × 120 mm), providing a compact, flexible and scalable compute module for robotics, Physical AI and autonomous system applications.

Built for Robotics and Physical AI

 

Built for demanding robotics and Physical AI applications,
the EDGE+ APEX X100 COM-HPC SOM combines high-performance CPU, GPU and NPU computing with up to 128 GB unified memory and versatile industrial connectivity. It delivers powerful real-time AI processing, concurrent agent performance and CPU capacity for next-generation autonomous systems.

Footnotes

1. Based on the mimik whitepaper “Architectural Fit for Production-Scale Agentic AI on Heterogeneous SoCs” commissioned by AMD, published by mimik on July 23, 2026, based on a modeled sweep of 455 feasible agentic AI workflows across two device classes (X100, NVIDIA Jetson T5000), checking spare CPU, GPU, and memory. For more information see: https://www.mimik.com/agentix-compute-benchmarking (REX-019)

3. Based on the OpenNav Robotics Workload Benchmark commissioned by AMD, published by Open Navigation LLC on July 23, 2026, as measured on the GMKtec EVO-X2 AI Mini PC AMD Ryzen AI Max+ 395 configured to reflect Ryzen AI Embedded X199 specifications (5.1 GHz CPU, 2.9 GHz GPU, 120W TDP, LPDDR5X-7500), vs. the NVIDIA Jetson AGX Thor Developer Kit: https://opennav.org/news/opennav-robotics-workload-benchmark (REX-018)

4. Based on the OpenNav Robotics Workload Benchmark commissioned by AMD, published by Open Navigation LLC on July 23, 2026, as measured on the GMKtec EVO-X2 AI Mini PC AMD Ryzen AI Max+ 395 configured to reflect Ryzen AI Embedded X199 specifications (5.1 GHz CPU, 2.9 GHz GPU, 120W TDP, LPDDR5X-7500), vs. the NVIDIA Jetson AGX Thor Developer Kit: https://opennav.org/news/opennav-robotics-workload-benchmark (REX-016).

AMD Ryzen™ AI Embedded X100 Series Processors

AMD Ryzen™ AI Embedded X100 Series processors combine an x86 CPU, a discrete-class integrated GPU (iGPU), and an NPU in a single SoC to deliver high-performance heterogeneous processing for autonomous systems. Built for the demanding compute requirements of physical AI, Ryzen AI X100 Series processors enable deterministic, low-latency performance for applications that need to sense, perceive, and act in real time.
Learn more

AMD Ryzen™ AI Embedded X199 Series Processors Specifications

Click Here for More Information

Name # of CPU Cores CPU Max Freq. GPU CU NPU TOPS TDP Junction Temp Range
AMD Ryzen™ AI Embedded X199 16 5.1 GHz 40 Up to 50 TOPS 55W 0-105°C


Thermal Design & Carrier Board Connectivity

The SAPPHIRE EDGE+ APEX X100 COM-HPC SOM features metal heat spreaders on both sides to support efficient thermal management for continuous operation. Board-to-board connectors on the underside provide a direct interface to a compatible carrier board, enabling flexible system integration and expansion for robotics and Physical AI applications.

AMD Kria™ AI Robotics Platform

Setting a New Standard for the Robot Brain

 The AMD Kria™ AI Robotics Developer Platform combines the SAPPHIRE EDGE+ APEX X100 COM-HPC SOM described above with a SAPPHIRE EDGE+ APEX Robotics Carrier Board, providing a complete development platform for robotics and Physical AI applications.

Learn more

SOM Block Diagram

Ordering Information

 

SKU#   Products  Memory Configuration
 52131-02-40T  EDGE+ APEX X199 COM-HPC SOM  128 GB
 52131-03-40T  EDGE+ APEX X199 COM-HPC SOM  64 GB

 

 

APEX Additional Reference Information

Complete Robotics APEX SOM/Carrier/Chassis are available with more to be added based on demand.


• Product Release: September 2026
• First Production Unit Shipments: December 2026
• For further information and sales inquiries please visit
    -  AMD Kria AI Robotics Developer Platform 
    -  SAPPHIRE EDGE+ Product Information

Applications

Specifications

Name

EDGE+ APEX X100 COM-HPC SOM

Form Factor

Form Factor : COM-HPC® Client Module
Pin-out Type : COM-HPC® Client
Module Size : COM-HPC Client Size B

Processor

  • CPU : AMD Ryzen™ AI Embedded X100 Series Processor
  • Architecture : AMD Glacier Peak, FP11 package
  • CPU Configuration : Multiple processor SKU option
  • TDP : Max. 85W
  • Management Controller : Infineon AURIX TC387Q
  • Safety PMIC : Infineon TLF35585
  • BIOS : UEFI BIOS, 64 MB SPI flash with RPMC support
  • Processor Junction Temp Range : 0 - 105 oC

Memory

  • Technology : LPDDR5X, up to 8000 MT/s
  • Memory Interface : 8 × 32-bit channels, 256-bit total memory bus
  • Bandwidth : Up to 240 GB/s
  • ECC Support : LPDDR5X Link-ECC
  • Max. Capacity : Max 128GB
  • Memory Type : 8 x soldered-down LPDDR5X devices

Displays

  • Digital Display Interface (DDI) : 3 x DDI Ports from APU support DisplayPort/HDMI
  • USB Type-C 4.0 : 2 x USB Type-C 4.0 with DP ALT-Mode
  • Maximum Multiple Displays : Up to 4 independent display outputs

Expansion

  • PCI Express : 1 × PCI Express x8 / 1 × PCI Express x4 / 4 × PCI Express x1
  • PCIe Reference Clock : 2 PCIe reference clock groups

Serial Bus

  • SMBus : 1 port
  • 12C Bus
            2 ports 
            I²C0 with Alert support
            I²C1 without Alert suppor
  

Ethernet

NBASE-T : 2 × 5GbE/2.5GbE

IO

  • USB 4 : 2 ports, support USB 4.0 / USB 3.2 / USB 2.0 and DP ALT-Mode
  • USB 3.2 : 2 ports, support USB 3.2 / USB 2.0
  • USB 2.0 : 4 ports, support USB 2.0
  • Camera Interface : 2 × 4-Lane MIPI CSI-2 D_PHY interface
  • Audio Interface : 2 × I²S/TDM interfaces
  • eSPI : 1 port
  • GP SPI : 1 port, up to 3 chip-selects
  • Boot SPI : 1 port
  • COM Port : 2 ports, 4-wire UART
  • GPIO : 12 GPIO ports
  • TPM : TPM 2.0
  • Watchdog : Supported by AURIX platform management controller
  • Smart Fan : 1 optional 4-wire smart fan interface
  • FuSa Interface : FuSa status, fault monitoring and safety communication

Power

  • Supply Voltage : Wide input voltage of 8 - 20V with 12V nominal
  • Standby Supply : VSB: 5 V nominal, optional
  • RTC Supply : RTC battery input, nominal 3.0V
  • Power Management : AURIX-controlled power sequencing, reset and fault monitoring

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